Invention Grant
- Patent Title: Method for fabricating a solid-state imaging package
- Patent Title (中): 固态成像封装的制造方法
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Application No.: US12555664Application Date: 2009-09-08
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Publication No.: US08952412B2Publication Date: 2015-02-10
- Inventor: Noboru Kawabata
- Applicant: Noboru Kawabata
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2005-356354 20051209
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L31/0203 ; H01L27/146
Abstract:
A method for manufacturing a solid-state imaging device. A solid-state image sensor is mounted on the semiconductor package support and electrically connected to first terminals and second terminals by bonding wires. The second terminals to which the bonding wires are connected are sealed with a sealing member. The optically-transparent member is thereafter disposed on the support member and the sealing member. The sealing member is cured to fix the optically transparent member.
Public/Granted literature
- US20100009490A1 METHOD FOR FABRICATING A SOLID-STATE IMAGING DEVICE Public/Granted day:2010-01-14
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