Invention Grant
- Patent Title: Three-dimensional semiconductor memory devices and methods for manufacturing same
- Patent Title (中): 三维半导体存储器件及其制造方法
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Application No.: US13828557Application Date: 2013-03-14
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Publication No.: US08952448B2Publication Date: 2015-02-10
- Inventor: Junkyu Yang , Phil Ouk Nam , Youngseon Son , Kwangyoung Lee , Kihyun Hwang
- Applicant: Junkyu Yang , Phil Ouk Nam , Youngseon Son , Kwangyoung Lee , Kihyun Hwang
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, PA
- Priority: KR10-2012-0054325 20120522
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L27/088 ; H01L27/115

Abstract:
A three-dimensional (3D) nonvolatile memory device includes a vertical stack of nonvolatile memory cells on a substrate having a region of first conductivity type therein. A dopant region of second conductivity type is provided in the substrate. This dopant region forms a P-N rectifying junction with the region of first conductivity type and has a concave upper surface that is recessed relative to an upper surface of the substrate upon which the vertical stack of nonvolatile memory cells extends. An electrically insulating electrode separating pattern is provided, which extends through the vertical stack of nonvolatile memory cells and into the recess in the dopant region of second conductivity type.
Public/Granted literature
- US20130313631A1 THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES AND METHODS FOR MANUFACTURING SAME Public/Granted day:2013-11-28
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