Invention Grant
US08952465B2 MEMS devices, packaged MEMS devices, and methods of manufacture thereof
有权
MEMS器件，封装的MEMS器件及其制造方法
- Patent Title: MEMS devices, packaged MEMS devices, and methods of manufacture thereof
- Patent Title (中): MEMS器件，封装的MEMS器件及其制造方法
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Application No.: US13549095Application Date: 2012-07-13
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Publication No.: US08952465B2Publication Date: 2015-02-10
- Inventor: Kai-Chih Liang , Chun-Wen Cheng
- Applicant: Kai-Chih Liang , Chun-Wen Cheng
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/84
- IPC: H01L29/84
Abstract:
MEMS devices, packaged MEMS devices, and methods of manufacture thereof are disclosed. In one embodiment, a microelectromechanical system (MEMS) device includes a first MEMS functional structure and a second MEMS functional structure. An interior region of the second MEMS functional structure has a pressure that is different than a pressure of an interior region of the first MEMS functional structure.
Public/Granted literature
- US20140015069A1 MEMS Devices, Packaged MEMS Devices, and Methods of Manufacture Thereof Public/Granted day:2014-01-16
Information query
IPC分类:
