Invention Grant
- Patent Title: Electronic device and its manufacturing method
- Patent Title (中): 电子器件及其制造方法
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Application No.: US14046423Application Date: 2013-10-04
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Publication No.: US08952467B2Publication Date: 2015-02-10
- Inventor: Takahiko Yoshizawa
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2012-231846 20121019
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L29/84 ; B81B7/00 ; B81C1/00 ; B81B7/02

Abstract:
An electronic device includes a substrate, a sidewall that is disposed on the substrate and forms a cavity, a first layer that is disposed on the sidewall and covers the cavity, a second layer that is formed on the first layer and has a region disposed outside an outline of the first layer in a plan view, a dielectric layer disposed below the region of the second layer disposed outside the outline of the first layer in a plan view, and a functional element disposed inside the cavity.
Public/Granted literature
- US20140110799A1 ELECTRONIC DEVICE AND ITS MANUFACTURING METHOD Public/Granted day:2014-04-24
Information query
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