An improved electrical-fuse (e-fuse) device including a dielectric layer having a first top surface, two conductive features embedded in the dielectric layer and a fuse element. Each conductive feature has a second top surface and a metal cap directly on the second top surface. Each metal cap has a third top surface that is above the first top surface of the dielectric layer. The fuse element is on the third top surface of each metal cap and on the first top surface of the dielectric layer. A method of forming the e-fuse device is also provided.