Invention Grant
US08952508B2 Lead frame, semiconductor manufacturing apparatus, and semiconductor device
有权
引线框架，半导体制造装置和半导体器件
- Patent Title: Lead frame, semiconductor manufacturing apparatus, and semiconductor device
- Patent Title (中): 引线框架，半导体制造装置和半导体器件
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Application No.: US13605687Application Date: 2012-09-06
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Publication No.: US08952508B2Publication Date: 2015-02-10
- Inventor: Eitaro Miyake
- Applicant: Eitaro Miyake
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan LLP
- Priority: JPP2011-205444 20110921
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01L21/56 ; H01L23/495 ; H01L23/00
Abstract:
According to one embodiment, a lead frame includes a die pad having a mounting surface on which a semiconductor chip is mounted, plural leads having inner leads and outer leads, and a connecting member that extends from the die pad to both ends of a plurality of leads and connects the die pad and the plurality leads so that the ends of the inner leads are positioned above of the mounting surface.
Public/Granted literature
- US20130119526A1 LEAD FRAME, SEMICONDUCTOR MANUFACTURING APPARATUS, AND SEMICONDUCTOR DEVICE Public/Granted day:2013-05-16
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