Invention Grant
- Patent Title: Integrated circuit package having bottom-side stiffener
- Patent Title (中): 集成电路封装，具有底侧加强件
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Application No.: US11959331Application Date: 2007-12-18
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Publication No.: US08952511B2Publication Date: 2015-02-10
- Inventor: Ajit V. Sathe , Mat J. Manusharow , Tong Wa Chao
- Applicant: Ajit V. Sathe , Mat J. Manusharow , Tong Wa Chao
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H05K3/30 ; H01L23/50
Abstract:
Embodiments of a bottom-side stiffening element are disclosed. The stiffening element may be disposed between an integrated circuit package and an underlying circuit board. In some embodiments, the stiffening element is attached to the underlying circuit board. Other embodiments are described and claimed.
Public/Granted literature
- US20090152738A1 INTEGRATED CIRCUIT PACKAGE HAVING BOTTOM-SIDE STIFFENER Public/Granted day:2009-06-18
Information query
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