Invention Grant
US08952518B2 Semiconductor device housing package, and semiconductor apparatus and electronic apparatus including the same
有权
半导体器件外壳封装，以及包括该半导体器件外壳封装的半导体器件和电子设备
- Patent Title: Semiconductor device housing package, and semiconductor apparatus and electronic apparatus including the same
- Patent Title (中): 半导体器件外壳封装，以及包括该半导体器件外壳封装的半导体器件和电子设备
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Application No.: US14006527Application Date: 2012-07-20
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Publication No.: US08952518B2Publication Date: 2015-02-10
- Inventor: Mahiro Tsujino , Manabu Miyahara
- Applicant: Mahiro Tsujino , Manabu Miyahara
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2011-163426 20110726
- International Application: PCT/JP2012/068436 WO 20120720
- International Announcement: WO2013/015216 WO 20130131
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L23/057 ; H01L23/10
Abstract:
A semiconductor device housing package includes a base body having, on its upper surface, a mounting region of a semiconductor device; a frame body having a frame-like portion disposed on the upper surface of the base body, surrounding the mounting region, and an opening penetrating through from an inner side of the frame-like portion to an outer side thereof; a flat plate-like insulating member disposed in the opening, extending from an interior of the frame body to an exterior thereof; wiring conductors disposed on an upper surface of the insulating member, extending from the interior of the frame body to the exterior thereof; and a metallic film disposed on a part of the upper surface of the insulating member, the metallic film lying outside the frame body surrounding the wiring conductors.
Public/Granted literature
Information query
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