Invention Grant
- Patent Title: Semiconductor packages and methods of manufacturing the same
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US13614125Application Date: 2012-09-13
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Publication No.: US08952549B2Publication Date: 2015-02-10
- Inventor: Doojin Kim , Youngsik Kim , Kitaik Oh , Sungbok Hong
- Applicant: Doojin Kim , Youngsik Kim , Kitaik Oh , Sungbok Hong
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2012-0012926 20120208
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor package comprises a board including a board pad, a plurality of semiconductor chips mounted on the board, the semiconductor chips including chip pads. Bumps are disposed on the chip pads, respectively, and a wire is disposed between the chip pads and the bumps. The wire electrically connects the chip pads of the plurality of semiconductor chips and the board pad to each other.
Public/Granted literature
- US20130200514A1 SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2013-08-08
Information query
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