Invention Grant
US08952552B2 Semiconductor package assembly systems and methods using DAM and trench structures
有权
使用DAM和沟槽结构的半导体封装组装系统和方法
- Patent Title: Semiconductor package assembly systems and methods using DAM and trench structures
- Patent Title (中): 使用DAM和沟槽结构的半导体封装组装系统和方法
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Application No.: US12621839Application Date: 2009-11-19
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Publication No.: US08952552B2Publication Date: 2015-02-10
- Inventor: Ruey Kae Zang , Wen-Sung Hsu
- Applicant: Ruey Kae Zang , Wen-Sung Hsu
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Michelle S. Gallardo
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/28 ; H01L21/56
Abstract:
A packaging system for preventing underfill overflow includes a package substrate having a solder mask a die attach site, a solder mask dam on the solder mask proximal to the die attach site, and a trench in the solder mask proximal to the die attach site. The trench and the solder mask dam are adapted to constrain flow of an underfill material.
Public/Granted literature
- US20110115083A1 Semiconductor Package Assembly Systems and Methods using DAM and Trench Structures Public/Granted day:2011-05-19
Information query
IPC分类:
