Invention Grant
- Patent Title: Method and apparatus for die testing
- Patent Title (中): 模具测试的方法和设备
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Application No.: US13369224Application Date: 2012-02-08
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Publication No.: US08952713B1Publication Date: 2015-02-10
- Inventor: Jayabrata Ghosh Dastidar , Aman Aflaki Beni , Zunhang Yu Kasnavi
- Applicant: Jayabrata Ghosh Dastidar , Aman Aflaki Beni , Zunhang Yu Kasnavi
- Applicant Address: US CA San Jose
- Assignee: Altera Corporation
- Current Assignee: Altera Corporation
- Current Assignee Address: US CA San Jose
- Agency: Womble, Carlyle, Sandridge & Rice, LLP
- Main IPC: G01R31/20
- IPC: G01R31/20

Abstract:
A device tester is provided. The device tester includes a probe card and a substrate coupled to the probe card. The substrate has a plurality of layers for routing a signal. An integrated circuit is coupled to the substrate. The integrated circuit is operable to transmit an input signal received from a testing apparatus to a device under test through the substrate to a signal probe. The signal probe is further operable to receive a test signal from the device under test in response to the input signal, wherein the integrated circuit is operable to amplify the test signal, and transmit the amplified test signal to the testing apparatus.
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