Invention Grant
- Patent Title: Three-dimensional memory array and operation scheme
- Patent Title (中): 三维存储阵列和操作方案
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Application No.: US13958648Application Date: 2013-08-05
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Publication No.: US08953367B2Publication Date: 2015-02-10
- Inventor: SangBum Kim , Chung H. Lam
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Ido Tuchman; Louis J. Percello
- Main IPC: G11C11/00
- IPC: G11C11/00 ; G11C13/00 ; G11C11/21 ; G11C7/18

Abstract:
A system, method and computer program product for operating a three-dimensional memory array. An example array includes access transistors with first, second and gate terminals. Bit lines are coupled to the first terminals, word lines coupled to the gate terminals, and vertical lines are coupled to the second terminals. The bit, word, and vertical lines are perpendicular to one another. Memory cells are positioned along the vertical lines, including a bidirectional access device coupled in series with a memory element. The memory element is programmable to first and second states by application of first and second write voltages, opposite in polarity to one another. The array includes conductive plates parallel to the word and bit lines, and perpendicular to the vertical lines. The conductive plates are coupled to memory cells of the same height and separated by insulating layers.
Public/Granted literature
- US20140160838A1 THREE-DIMENSIONAL MEMORY ARRAY AND OPERATION SCHEME Public/Granted day:2014-06-12
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