Invention Grant
- Patent Title: X-ray stress measurement method and apparatus
- Patent Title (中): X射线应力测量方法和装置
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Application No.: US13917829Application Date: 2013-06-14
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Publication No.: US08953743B2Publication Date: 2015-02-10
- Inventor: Shoichi Yasukawa
- Applicant: Rigaku Corporation
- Applicant Address: JP Tokyo
- Assignee: Rigaku Corporation
- Current Assignee: Rigaku Corporation
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2012-164632 20120725
- Main IPC: G01N23/20
- IPC: G01N23/20 ; G01L1/25 ; G01N23/207

Abstract:
A sample (1) is irradiated with X-rays at different incident angles from plural X-ray sources (21, 22). Attention is focused on a Debye-ring of each X-ray diffraction emitted conically from the sample in association with incident X-ray from each of the X-ray sources (21, 22), and stress in the sample (1) is determined on the basis of information of X-ray diffraction appearing at an intersection point between the Debye-ring of the X-ray diffraction recorded on an image plate (30) and an equatorial plane (H) and information of X-ray diffraction appearing in the neighborhood of the intersection point between the Debye-ring and the equatorial plane (H).
Public/Granted literature
- US20140029726A1 X-RAY STRESS MEASUREMENT METHOD AND APPARATUS Public/Granted day:2014-01-30
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