Invention Grant
US08954150B2 Side mount feedthrough system for sealed components 有权
用于密封组件的侧装式馈通系统

Side mount feedthrough system for sealed components
Abstract:
The present subject matter provides apparatus and methods for manufacturing an encasement for a component of an implantable medical device having a main circuit board. The method includes forming an encasement aperture on a lateral side of the encasement. The lateral side of the encasement is adapted to be placed substantially parallel to a surface of the main circuit board. A feedthrough assembly is connected through the encasement aperture. The feedthrough assembly includes at least one terminal conductor at least partially passing through the encasement aperture.
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