Invention Grant
- Patent Title: RF resistant feedthrough assembly and electrical stimulation systems containing the assembly
- Patent Title (中): 射频电阻馈电组件和含有组件的电刺激系统
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Application No.: US14166672Application Date: 2014-01-28
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Publication No.: US08954151B2Publication Date: 2015-02-10
- Inventor: Thomas Lopez , Matthew Lee McDonald , Gaurav Gupta
- Applicant: Boston Scientific Neuromodulation Corporation
- Applicant Address: US CA Valencia
- Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee Address: US CA Valencia
- Agency: Lowe Graham Jones PLLC
- Agent Bruce E. Black
- Main IPC: A61N1/375
- IPC: A61N1/375

Abstract:
A control module for an electrical stimulation system includes a casing having an electrically-conductive portion; an electronic subassembly disposed in the casing; and a header portion coupled to the casing and including a connector for a lead or lead extension. The control module also includes a feedthrough assembly coupling the casing to the header portion. The feedthrough assembly includes a non-conductive ceramic block; conductive feedthrough pins passing through the ceramic block and electrically coupling the connector to the electronic subassembly disposed in the casing; a metal flange disposed around, and attached to, the ceramic block, and a non-conductive spacer attached to the metal flange and to the casing to raise the ceramic block above, and away from, the casing. Other control modules include a ceramic block that has a rim portion that raises the plate portion, through which the feedthrough pins pass, of the block away from the casing.
Public/Granted literature
- US20140214130A1 RF RESISTANT FEEDTHROUGH ASSEMBLY AND ELECTRICAL STIMULATION SYSTEMS CONTAINING THE ASSEMBLY Public/Granted day:2014-07-31
Information query
IPC分类: