Invention Grant
US08954308B2 Modeling of multi-layered power/ground planes using triangle elements
有权
使用三角形元素建模多层电力/接地平面
- Patent Title: Modeling of multi-layered power/ground planes using triangle elements
- Patent Title (中): 使用三角形元素建模多层电力/接地平面
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Application No.: US13403594Application Date: 2012-02-23
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Publication No.: US08954308B2Publication Date: 2015-02-10
- Inventor: Jae Young Choi , Madhavan Swaminathan
- Applicant: Jae Young Choi , Madhavan Swaminathan
- Applicant Address: US GA Atlanta
- Assignee: Georgia Tech Research Corporation
- Current Assignee: Georgia Tech Research Corporation
- Current Assignee Address: US GA Atlanta
- Agency: Bockhop & Associates, LLC
- Agent Bryan W. Bockhop
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
In a method of simulating electrical characteristics of a circuit board having a plurality of features, the plurality of features is projected onto a planar construct. A Delaunay triangulation routine for generating a triangular mesh that corresponds to the single planar construct is executed on the digital computer. A routine that generates a Voronoi diagram corresponding to the triangular mesh. An equivalent circuit for each triangle is determined. The equivalent circuit includes exactly three sub-circuits that couple a vertex within the triangle to a vertex within an adjacent triangle and exactly one sub-circuit that couples the vertex within the triangle to a reference plane. A routine solves, for each triangle, an equation describing an electrical characteristic value based on the equivalent circuit corresponding to the triangle. A routine for generating a human-perceptible indication of the electrical characteristic value for each triangle is executed on the digital computer.
Public/Granted literature
- US20120150523A1 Modeling of Multi-Layered Power/Ground Planes using Triangle Elements Public/Granted day:2012-06-14
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