Invention Grant
- Patent Title: Resin composition for insulating layer for multi-layered printed board
- Patent Title (中): 多层印刷电路板绝缘层用树脂组合物
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Application No.: US14136107Application Date: 2013-12-20
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Publication No.: US08956702B2Publication Date: 2015-02-17
- Inventor: Kenji Kawai , Shigeo Nakamura
- Applicant: Ajinomoto Co., Inc.
- Applicant Address: JP Chuo-ku
- Assignee: Ajinomoto Co., Inc.
- Current Assignee: Ajinomoto Co., Inc.
- Current Assignee Address: JP Chuo-ku
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-344686 20051129; JP2006-045637 20060222
- Main IPC: B05D3/12
- IPC: B05D3/12 ; B05D7/14 ; C08L63/00 ; H05K3/46 ; C08G59/62 ; C08L71/00 ; C08L21/00 ; H05K3/38
Abstract:
Epoxy resin compositions, which comprise (A) en epoxy resin having two or more epoxy groups in a molecule; (B) a phenol type curing agent where an average hydroxyl group content in a molecule (a mean value of (the total number of hydroxyl groups)/(the total number of benzene rings)), P, satisfies the equation 0
Public/Granted literature
- US20140102623A1 RESIN COMPOSITION FOR INSULATING LAYER FOR MULTI-LAYERED PRINTED BOARD Public/Granted day:2014-04-17
Information query
