Invention Grant
- Patent Title: Interconnect for high-frequency printed circuit
- Patent Title (中): 互连高频印刷电路
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Application No.: US12879915Application Date: 2010-09-10
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Publication No.: US08957324B2Publication Date: 2015-02-17
- Inventor: Pascal Cornic , Jean-Philippe Coupez , Jérémie Hemery , Julien Boucher
- Applicant: Pascal Cornic , Jean-Philippe Coupez , Jérémie Hemery , Julien Boucher
- Applicant Address: FR Neuilly sur Seine FR Brest
- Assignee: Thales,Groupe des Telecommunications/Ecole Nationale Superieure des Telecoms Bretagne
- Current Assignee: Thales,Groupe des Telecommunications/Ecole Nationale Superieure des Telecoms Bretagne
- Current Assignee Address: FR Neuilly sur Seine FR Brest
- Agency: Baker Hostetler LLP
- Priority: FR0904348 20090911
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01P3/08 ; H05K1/02 ; H05K3/42

Abstract:
The invention relates to a printed circuit for high-frequency signals, and more particularly to interconnect means between transmission lines situated on different faces of the printed circuit. According to the invention, in the vicinity of the interconnect means, the transmission lines each extend in a main direction. The interconnect means comprise two vias each extending along an axis. In a plane containing the main direction of a first of the transmission lines and perpendicular to the face bearing the first transmission line, an orthogonal fix is formed whose abscissa is borne by the main direction of the first transmission line. The abscissae of the axes of the vias or of their projection on the plane, perpendicularly to the plane, are separate.
Public/Granted literature
- US20110215882A1 Interconnect for High-Frequency Printed Circuit Public/Granted day:2011-09-08
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