Invention Grant
- Patent Title: Method of manufacturing circuit board, method of manufacturing electronic device, and electronic device
- Patent Title (中): 电路板的制造方法，电子装置的制造方法以及电子装置
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Application No.: US13426874Application Date: 2012-03-22
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Publication No.: US08959758B2Publication Date: 2015-02-24
- Inventor: Kazuya Arai , Shinpei Ikegami , Hitoshi Suzuki , Kei Fukui
- Applicant: Kazuya Arai , Shinpei Ikegami , Hitoshi Suzuki , Kei Fukui
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Squire Patton Boggs (US) LLP
- Priority: JP2011-069039 20110326
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H01L21/48 ; H05K3/46 ; H01L23/498 ; H01L23/00 ; H05K1/11
Abstract:
A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode, and removing the support substrate to expose a second surface of the first electrode after forming the first wiring.
Public/Granted literature
- US20120241206A1 METHOD OF MANUFACTURING CIRCUIT BOARD, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE Public/Granted day:2012-09-27
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