Invention Grant
- Patent Title: Fuse housing assembly
- Patent Title (中): 保险丝座总成
-
Application No.: US13907050Application Date: 2013-05-31
-
Publication No.: US08961197B2Publication Date: 2015-02-24
- Inventor: Joan Ignasi Ferran Palau , Antonio Tomas Amenos , Antonio Palomo Lorenzo
- Applicant: Lear Corporation
- Applicant Address: US MI Southfield
- Assignee: Lear Corporation
- Current Assignee: Lear Corporation
- Current Assignee Address: US MI Southfield
- Agency: Brooks Kushman P.C.
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R33/06 ; H01H85/20 ; H01R12/58

Abstract:
A fuse housing assembly is provided with a housing having a base adapted to be mounted to a printed circuit board (PCB) at least partially over a through aperture. The housing has at least one receptacle sized to receive a case-type fuse. The housing has an aperture in the base aligned with the at least one receptacle for receipt of a terminal blade from the PCB for electrical communication with the case-type fuse. At least one connector blade is mounted to the housing and extends into the at least one receptacle and extends through the base to extend through the PCB through aperture for electrical communication with the case-type fuse and the connector.
Public/Granted literature
- US20130330949A1 FUSE HOUSING ASSEMBLY Public/Granted day:2013-12-12
Information query