Invention Grant
- Patent Title: Method for guiding and bonding strands to a substrate
- Patent Title (中): 用于将线引导和接合到基底的方法
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Application No.: US13684844Application Date: 2012-11-26
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Publication No.: US08961720B2Publication Date: 2015-02-24
- Inventor: Michael W. Harris , Alan Ramspeck
- Applicant: Nordson Corporation
- Applicant Address: US OH Westlake
- Assignee: Nordson Corporation
- Current Assignee: Nordson Corporation
- Current Assignee Address: US OH Westlake
- Agency: Wood, Herron & Evans, L.L.P.
- Main IPC: B05C5/02
- IPC: B05C5/02 ; B65H57/16 ; B05C1/00 ; B65H57/04 ; B65H57/14 ; A61F13/15 ; B29C65/48

Abstract:
A method of bonding first and second strands onto a substrate traveling along a machine direction in a plane of travel. The method includes moving the first and second strands in the machine direction relative to a nozzle having a nozzle body with first and second liquid discharge passages, and first and second side-by-side notches. The first and second strands are guided for movement by engaging closed ends of the respective first and second notches. Open ends of the first and second notches are oriented or directed non-perpendicular to the plane of travel of the substrate. Liquid adhesive is dispensed onto the first and second strands from the liquid discharge passages and the first and second strands are bonded to the substrate.
Public/Granted literature
- US20140144577A1 METHOD FOR GUIDING AND BONDING STRANDS TO A SUBSTRATE Public/Granted day:2014-05-29
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