Invention Grant
- Patent Title: High aspect ratio adhesive structure and a method of forming the same
- Patent Title (中): 高纵横比粘合剂结构及其形成方法
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Application No.: US13202090Application Date: 2010-02-12
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Publication No.: US08961855B2Publication Date: 2015-02-24
- Inventor: Yoke Yee Audrey Ho , Isabel Rodriguez Fernandez
- Applicant: Yoke Yee Audrey Ho , Isabel Rodriguez Fernandez
- Applicant Address: SG Singapore
- Assignee: Agency for Science, Technology and Research
- Current Assignee: Agency for Science, Technology and Research
- Current Assignee Address: SG Singapore
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- International Application: PCT/SG2010/000056 WO 20100212
- International Announcement: WO2010/096023 WO 20100826
- Main IPC: B29C33/38
- IPC: B29C33/38 ; B29C59/02 ; B29C39/02 ; B81C1/00 ; C09J7/00 ; B32B3/30 ; B29C41/00 ; B29C43/02
Abstract:
A method of forming a high aspect ratio adhesive structure, the method comprising fabricating a porous template comprising at least a first tier and a second tier; introducing a softened polymer into the template; and separating the polymer from the template.
Public/Granted literature
- US20110300339A1 HIGH ASPECT RATIO ADHESIVE STRUCTURE AND A METHOD OF FORMING THE SAME Public/Granted day:2011-12-08
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