Invention Grant
- Patent Title: Optical element package and method of manufacturing the same
- Patent Title (中): 光学元件封装及其制造方法
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Application No.: US13426244Application Date: 2012-03-21
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Publication No.: US08962355B2Publication Date: 2015-02-24
- Inventor: Hiroyuki Fukasawa , Tsutomu Tanaka
- Applicant: Hiroyuki Fukasawa , Tsutomu Tanaka
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JPP2009-019320 20090130
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/54 ; H01L23/00 ; H01L31/0232
Abstract:
An optical element package includes: an optical element in a form of a chip, and a lens resin having a convex lens surface covering an optical functional surface of the optical element. The convex lens surface is formed as a rough surface having a plurality of minute convex curved surfaces having a vertex in a direction perpendicular to a plane in contact with each part of the convex lens surface.
Public/Granted literature
- US20120175793A1 OPTICAL ELEMENT PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-07-12
Information query
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