Invention Grant
- Patent Title: Method for manufacturing fan-out lines on array substrate
- Patent Title (中): 在阵列基板上制造扇出线的方法
-
Application No.: US14077770Application Date: 2013-11-12
-
Publication No.: US08962404B2Publication Date: 2015-02-24
- Inventor: Jinchao Bai , Liang Sun , Xiangqian Ding , Liangliang Li , Yao Liu
- Applicant: Boe Technology Group Co., Ltd. , Beijing Boe Display Technology Co., Ltd.
- Applicant Address: CN Beijing CN Beijing
- Assignee: Boe Technology Group Co., Ltd.,Beijing Boe Display Technology Co., Ltd.
- Current Assignee: Boe Technology Group Co., Ltd.,Beijing Boe Display Technology Co., Ltd.
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN201210454642 20121113
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/12

Abstract:
A method for manufacturing fan-out lines on an array substrate is disclosed. The fan-out lines comprise an amorphous silicon layer, an ohmic contact layer and a source-drain electrode layer disposed on a gate insulating layer. The manufacturing processes can be conducted by forming a first layer of photoresist on the source-drain electrode layer and performing a half-exposure development process on the first layer of photoresist; etching the amorphous silicon layer, the ohmic contact layer and the source-drain electrode layer by an etching process; removing the first layer of photoresist; forming a second layer of photoresist and performing full-exposure development process on the second layer of photoresist; and etching the amorphous silicon layer by etching process to form the fan-out lines.
Public/Granted literature
- US20140134809A1 METHOD FOR MANUFACTURING FAN-OUT LINES ON ARRAY SUBSTRATE Public/Granted day:2014-05-15
Information query
IPC分类: