Invention Grant
US08962405B2 Method of manufacturing semiconductor device by mounting and positioning a semiconductor die using detection marks
有权
通过使用检测标记安装和定位半导体管芯来制造半导体器件的方法
- Patent Title: Method of manufacturing semiconductor device by mounting and positioning a semiconductor die using detection marks
- Patent Title (中): 通过使用检测标记安装和定位半导体管芯来制造半导体器件的方法
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Application No.: US13798589Application Date: 2013-03-13
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Publication No.: US08962405B2Publication Date: 2015-02-24
- Inventor: Tsunehiro Nakajima , Haruo Nakazawa
- Applicant: Fuji Electric Co., Ltd.
- Applicant Address: JP
- Assignee: Fuji Electric Co., Ltd.
- Current Assignee: Fuji Electric Co., Ltd.
- Current Assignee Address: JP
- Agency: Rossi, Kimms & McDowell LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/84 ; H01L21/66 ; G03F9/00 ; H01L29/06 ; H01L29/66 ; H01L29/739 ; H01L21/683 ; H01L23/544 ; H01L21/266
Abstract:
In some aspects of the invention, a circuit pattern of a front surface structure is formed in a front surface of a semiconductor wafer and an alignment mark is formed on the front surface of a semiconductor wafer. A transparent supporting substrate is attached to the front surface of the semiconductor wafer by a transparent adhesive. Then, a resist is applied onto a rear surface of the semiconductor wafer. Then, the semiconductor wafer is mounted on a stage of an exposure apparatus, with the supporting substrate down. Then, the alignment mark formed on the front surface of the semiconductor wafer is recognized by a camera, and the positions of the semiconductor wafer and a photomask are aligned with each other. Then, the resist is patterned. Then, a circuit pattern is formed in the rear surface of the semiconductor wafer.
Public/Granted literature
- US20130196457A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2013-08-01
Information query
IPC分类:
