Disclosed is a phenol resin molding material comprising 100 parts by weight of a resol type phenol resin, 40 to 100 parts by weight of an inorganic fiber, 30 to 90 parts by weight of a natural silica powder having an average particle size of 0.5 to 15 μm and subjected to a coupling agent treatment and 1 to 15 parts by weight of a rubber component as main components. The molding material can contain 50% by weight or more of a glass fiber and a natural silica powder having a crushed shape can be used as the natural silica powder. As a molded article produced from the resin molding material, a resin pulley is exemplified.