Invention Grant
- Patent Title: Extruded frame structures to house a conductor
- Patent Title (中): 挤压框架结构以容纳导体
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Application No.: US12725364Application Date: 2010-03-16
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Publication No.: US08963004B2Publication Date: 2015-02-24
- Inventor: Ray Goody
- Applicant: Ray Goody
- Applicant Address: US IL Rosemont
- Assignee: SAPA Extrusions, Inc.
- Current Assignee: SAPA Extrusions, Inc.
- Current Assignee Address: US IL Rosemont
- Agency: Loeb & Loeb LLP
- Main IPC: H01B7/00
- IPC: H01B7/00 ; B21C23/22 ; B21C23/14 ; H02G5/02 ; H02G3/04 ; H03G3/18
Abstract:
Embodiments of the present disclosure provide extruded frame structures to house a conductor and associated techniques and configurations. An apparatus includes an extruded frame structure having a frame profile configured to house a conductor and insulator. Other embodiments may be described and/or claimed.
Public/Granted literature
- US20100230162A1 EXTRUDED FRAME STRUCTURES TO HOUSE A CONDUCTOR Public/Granted day:2010-09-16
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