Invention Grant
- Patent Title: Flexible circuit board
- Patent Title (中): 柔性电路板
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Application No.: US13351323Application Date: 2012-01-17
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Publication No.: US08963012B2Publication Date: 2015-02-24
- Inventor: Hiroharu Uehara , Katsuhide Nakai , Hiroki Shirato
- Applicant: Hiroharu Uehara , Katsuhide Nakai , Hiroki Shirato
- Applicant Address: JP
- Assignee: Canon Components, Inc.
- Current Assignee: Canon Components, Inc.
- Current Assignee Address: JP
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2011-007362 20110117
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18 ; H05K1/05 ; H05K3/40
Abstract:
A flexible circuit board includes a base film which is composed of an aluminum sheet and first protective films formed on the respective surfaces of the aluminum sheet and has a sprocket hole and a device hole, a predetermined conductor pattern which is formed on a surface of the base film, and a second protective film which is composed of aluminum and an electrically insulative film formed on a surface of the aluminum and is formed so as to cover the predetermined conductor pattern.
Public/Granted literature
- US20120186858A1 FLEXIBLE CIRCUIT BOARD Public/Granted day:2012-07-26
Information query
