Invention Grant
- Patent Title: Enclosure for electronics
- Patent Title (中): 电子附件
-
Application No.: US13239088Application Date: 2011-09-21
-
Publication No.: US08963023B2Publication Date: 2015-02-24
- Inventor: Nickolas Phillips , Dusan Jankov , Victor S. Pak
- Applicant: Nickolas Phillips , Dusan Jankov , Victor S. Pak
- Applicant Address: US CA Hayward
- Assignee: Pakedge Device & Software, Inc.
- Current Assignee: Pakedge Device & Software, Inc.
- Current Assignee Address: US CA Hayward
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H01H9/02 ; H01H13/04 ; H01H19/04 ; H01H21/04 ; H01H23/04 ; H01R13/46 ; H02G3/08 ; H02G3/20 ; H01R13/44 ; H01R13/60 ; E05D7/00 ; H02G3/12

Abstract:
An electronics enclosure includes a housing having a body section that has a hollow or open interior for containing electrical devices. The body section is configured for flush mounting in a ceiling, wall or other structure. The enclosure includes a moveable front panel that pivots to flip between a closed position and an open position. An electronic device may be mounted to the back surface of the front panel, to be hidden from view when the panel is closed and to be accessible when the panel is open. The enclosure includes anchoring mechanisms that rotate between first and second positions, to anchor the enclosure in the ceiling, wall or other structure.
Public/Granted literature
- US20120073874A1 ENCLOSURE FOR ELECTRONICS Public/Granted day:2012-03-29
Information query