Invention Grant
- Patent Title: Thin film transistor, array substrate, and manufacturing method thereof
- Patent Title (中): 薄膜晶体管,阵列基板及其制造方法
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Application No.: US13994244Application Date: 2012-11-13
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Publication No.: US08963157B2Publication Date: 2015-02-24
- Inventor: Yinan Liang
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN201210226591 20120629
- International Application: PCT/CN2012/084543 WO 20121113
- International Announcement: WO2014/000367 WO 20140103
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L21/02 ; H01L29/66 ; H01L29/786 ; H01L27/12

Abstract:
A thin film transistor, an array substrate, and a manufacturing method thereof. The manufacturing method comprises: forming a buffer layer and an active layer sequentially on a substrate, and forming an active region through a patterning process; forming a gate insulating layer and a gate electrode sequentially; forming Ni deposition openings; forming a dielectric layer having source/drain contact holes in a one-to-one correspondence with the Ni deposition openings; and forming source/drain electrodes which are connected with the active region via the source/drain contact holes and the Ni deposition openings.
Public/Granted literature
- US20140110718A1 THIN FILM TRANSISTOR, ARRAY SUBSTRATE, AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-04-24
Information query
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