Invention Grant
- Patent Title: Light emitting diode package and method of manufacturing the same
- Patent Title (中): 发光二极管封装及其制造方法
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Application No.: US11585855Application Date: 2006-10-25
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Publication No.: US08963188B2Publication Date: 2015-02-24
- Inventor: Bo Geun Park
- Applicant: Bo Geun Park
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2005-0101772 20051027
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/54 ; B29C39/02 ; B29C39/10 ; B29L11/00
Abstract:
A light emitting diode (LED) package is provided. The LED package includes a printed circuit board (PCB), an electrode pad, an LED, a wire, and first and second moldings. The electrode pad and the LED are formed on the PCB. The wire electrically connects the LED with the electrode pad. The first molding is formed on the LED and the second molding is formed on the first molding.
Public/Granted literature
- US20070096129A1 Light emitting diode package and method of manufacturing the same Public/Granted day:2007-05-03
Information query
IPC分类:
