Invention Grant
- Patent Title: Heat-transfer structure
- Patent Title (中): 传热结构
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Application No.: US12143594Application Date: 2008-06-20
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Publication No.: US08963323B2Publication Date: 2015-02-24
- Inventor: Roger Scott Kempers , Shankar Krishnan , Alan Michael Lyons , Todd Richard Salamon
- Applicant: Roger Scott Kempers , Shankar Krishnan , Alan Michael Lyons , Todd Richard Salamon
- Applicant Address: FR Boulogne-Billancourt
- Assignee: Alcatel Lucent
- Current Assignee: Alcatel Lucent
- Current Assignee Address: FR Boulogne-Billancourt
- Agency: Hitt Gaines, PC
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/00 ; H01L23/42 ; H01L23/367 ; H01L25/065 ; B21D53/02
Abstract:
An apparatus 100 comprising a first substrate 130 having a first surface 125, a second substrate 132 having a second surface 127 facing the first surface and an array 170 of metallic raised features 170 being located on the first surface, each raised feature being in contact with the first surface to the second surface, a portion of the raised features being deformed via a compressive force 305.
Public/Granted literature
- US20090315173A1 HEAT-TRANSFER STRUCTURE Public/Granted day:2009-12-24
Information query
IPC分类:
