Invention Grant
- Patent Title: Circuit structures and electronic systems
- Patent Title (中): 电路结构和电子系统
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Application No.: US13401534Application Date: 2012-02-21
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Publication No.: US08963330B2Publication Date: 2015-02-24
- Inventor: John Smythe
- Applicant: John Smythe
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/768 ; H01L21/288 ; H01L21/316 ; H01L21/3205
Abstract:
The invention includes methods of forming layers conformally over undulating surface topographies associated with semiconductor substrates. The undulating surface topographies can first be exposed to one or more of titanium oxide, neodymium oxide, yttrium oxide, zirconium oxide and vanadium oxide to treat the surfaces, and can be subsequently exposed to a material that forms a layer conformally along the treated surfaces. The material can, for example, comprise an aluminum-containing compound and one or both of silane and silazane. The invention also includes semiconductor constructions having conformal layers formed over liners containing one or more of titanium oxide, yttrium oxide, zirconium oxide and vanadium oxide.
Public/Granted literature
- US20120146222A1 Circuit Structures and Electronic Systems Public/Granted day:2012-06-14
Information query
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