Invention Grant
- Patent Title: Performance of off-chip connection for power amplifier
- Patent Title (中): 功率放大器片外连接的性能
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Application No.: US13702786Application Date: 2011-06-13
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Publication No.: US08963642B2Publication Date: 2015-02-24
- Inventor: Martin Paul Wilson
- Applicant: Martin Paul Wilson
- Applicant Address: GB
- Assignee: Nujira Limited
- Current Assignee: Nujira Limited
- Current Assignee Address: GB
- Agency: Kaplan Breyer Schwarz & Ottsen, LLP
- Priority: GB1009857.2 20100611
- International Application: PCT/EP2011/059760 WO 20110613
- International Announcement: WO2011/154547 WO 20111215
- Main IPC: H03F3/18
- IPC: H03F3/18 ; H03F3/26 ; H03F3/195 ; H03F3/30
Abstract:
There is provided an integrated circuit comprising a main push-pull amplifier (108, 110) with balanced outputs and an additional push-pull amplifier (862, 863) with balanced outputs. Each of these balanced outputs is connected to an off-chip load (822) via respective bonding wires (818, 828, 830, 880) to provide a combined amplified signal to the load. The additional amplifier serves to compensate for crossover distortions generated by the main amplifier.
Public/Granted literature
- US20130141165A1 PERFORMANCE OF OFF-CHIP CONNECTION FOR POWER AMPLIFIER Public/Granted day:2013-06-06
Information query
