Invention Grant
- Patent Title: Breach detection in solid structures
- Patent Title (中): 固体结构中的违规检测
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Application No.: US13349327Application Date: 2012-01-12
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Publication No.: US08963708B2Publication Date: 2015-02-24
- Inventor: Richard D. Y. Chen
- Applicant: Richard D. Y. Chen
- Applicant Address: US CA Napa
- Assignee: Sensurtec, Inc.
- Current Assignee: Sensurtec, Inc.
- Current Assignee Address: US CA Napa
- Agency: Wilson Sonsini Goodrich & Rosati
- Main IPC: G08B21/00
- IPC: G08B21/00 ; G08B1/08 ; G08B23/00 ; A61B5/00 ; A61B19/00 ; A61M29/00 ; A61F2/52 ; A61F2/12 ; A61F2/36 ; A61F2/32 ; A61B5/07 ; A61N1/08 ; A61N1/37 ; A61N1/372 ; A61F2/30 ; A61F2/48

Abstract:
An implantable device includes at least one solid structure having an external surface and a volume beneath the surface. One or more of a first conductor or set of conductors is disposed externally and/or internally on or within the structure and an array of elongate electrically conductive elements are disposed radially outwardly within the volume. A breach is detected when a conductive fluid intrudes into the volume through the surface.
Public/Granted literature
- US20130281793A1 BREACH DETECTION IN SOLID STRUCTURES Public/Granted day:2013-10-24
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