Invention Grant
- Patent Title: Mounting structures for components in electronic devices
- Patent Title (中): 电子设备组件的安装结构
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Application No.: US12794633Application Date: 2010-06-04
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Publication No.: US08964352B2Publication Date: 2015-02-24
- Inventor: Trent Weber , Michael B. Wittenberg , Michelle A. Yu
- Applicant: Trent Weber , Michael B. Wittenberg , Michelle A. Yu
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: H01G5/01
- IPC: H01G5/01 ; H01H9/02 ; H04M1/02 ; H04M1/23 ; H04M1/03

Abstract:
An electronic device may be provided with a housing having housing sidewalls. A plate may be connected between a pair of the sidewalls. An audio jack may be mounted to the plate. A microphone may be mounted within the device between the audio jack and a given one of the sidewalls. A vibrator may be mounted between one of the sidewalls and the audio jack using a bracket. The vibrator may have a weight that is tapered along its length. A button may be formed in an opening in one of the housing sidewalls. The button may have a button member with a protrusion that extends through a button opening in the sidewall. A support structure may be interposed between a switch and the button member. The switch may have a portion that extends through an opening in the support structure and that is actuated by the button member.
Public/Granted literature
- US20110255259A1 MOUNTING STRUCTURES FOR COMPONENTS IN ELECTRONIC DEVICES Public/Granted day:2011-10-20
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