Invention Grant
- Patent Title: Structure and method for a SRAM circuit
- Patent Title (中): SRAM电路的结构和方法
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Application No.: US13414323Application Date: 2012-03-07
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Publication No.: US08964455B2Publication Date: 2015-02-24
- Inventor: Jhon Jhy Liaw
- Applicant: Jhon Jhy Liaw
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G11C11/00
- IPC: G11C11/00

Abstract:
The present disclosure provides an integrated circuit formed in a semiconductor substrate. The integrated circuit includes a first static random access memory (SRAM) cell having a first cell size; and a second SRAM cell having a second cell size greater than the first cell size. The first SRAM cell includes first n-type field effect transistors (nFETs) each having a first gate stack. The second SRAM cell includes second nFETs each having a second gate stack different from the first gate stack.
Public/Granted literature
- US20130235652A1 STRUCTURE AND METHOD FOR A SRAM CIRCUIT Public/Granted day:2013-09-12
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