Invention Grant
- Patent Title: Method of manufacturing a sensor network incorporating stretchable silicon
- Patent Title (中): 制造包含可拉伸硅的传感器网络的方法
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Application No.: US13084729Application Date: 2011-04-12
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Publication No.: US08966730B1Publication Date: 2015-03-03
- Inventor: Michael Alexander Carralero , John Lyle Vian
- Applicant: Michael Alexander Carralero , John Lyle Vian
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Armstrong Teasdale LLP
- Main IPC: H01L41/04
- IPC: H01L41/04 ; H01L41/25 ; H01L41/29 ; B82Y40/00 ; G01M5/00 ; B82B3/00 ; H01L41/08 ; H01L21/02 ; B82Y30/00 ; B82Y10/00
Abstract:
A method of manufacturing a sensor network is described which includes stretching a silicon substrate over a desired area, and generating a plurality of nodes fabricated on the stretchable silicon substrate. The nodes include at least one of an energy harvesting and storage element, a communication device, a sensing device, and a processor. The nodes are interconnected via interconnecting conductors formed in the substrate.
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