Invention Grant
- Patent Title: Method for manufacturing an arrangement with a component on a carrier substrate and a method for manufacturing a semi-finished product
- Patent Title (中): 用于制造在载体基板上的部件的布置的方法和半成品的制造方法
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Application No.: US13497585Application Date: 2010-09-24
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Publication No.: US08966748B2Publication Date: 2015-03-03
- Inventor: Jürgen Leib , Simon Maus , Ulli Hansen
- Applicant: Jürgen Leib , Simon Maus , Ulli Hansen
- Applicant Address: DE
- Assignee: MSG Lithoglas AG
- Current Assignee: MSG Lithoglas AG
- Current Assignee Address: DE
- Agency: Schmeiser, Olsen & Watts, LLP
- Priority: DE102009042479 20090924
- International Application: PCT/DE2010/075096 WO 20100924
- International Announcement: WO2011/035783 WO 20110331
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H01L31/0203 ; H01L33/00 ; H01L33/48 ; H01L33/58 ; H01L33/60
Abstract:
The invention relates to a method for manufacturing an arrangement with a component on a carrier substrate, wherein the method encompasses the following steps: Manufacturing spacer elements on the rear side of a cover substrate, arranging a component on a cover surface of a carrier substrate, and arranging the spacer elements formed on the carrier substrate so as to situate the component in the at least one hollow space and close the latter. In addition, the invention relates to an arrangement, a method for manufacturing a semi-finished product for a component arrangement, as well as a semi-finished product for a component arrangement.
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