Invention Grant
- Patent Title: Cutting apparatus
- Patent Title (中): 切割设备
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Application No.: US13659265Application Date: 2012-10-24
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Publication No.: US08966770B2Publication Date: 2015-03-03
- Inventor: Ping Sun Lau
- Applicant: Ping Sun Lau
- Agency: Novoclaims Patent Services LLC
- Agent Mei Lin Wong
- Main IPC: B26B1/04
- IPC: B26B1/04

Abstract:
A cutting apparatus includes a handle frame, a cutting blade, and a blade rotation arrangement. The cutting blade has a first blade portion and a second blade portion. The blade rotation arrangement includes a pivot, a securing frame and an actuation member. The cutting blade is arranged to rotate between a first position and a second position, wherein in the first position, the first blade portion is extended out of the receiving cavity while the second blade portion is received in the receiving cavity, wherein in the second position, the second blade portion is extended out of the receiving cavity while the first blade portion is received in the receiving cavity. The securing frame is mounted in the receiving cavity for reinforcing the cutting blade when the cutting blade move between and at the first position and the second position.
Public/Granted literature
- US20140109414A1 Cutting Apparatus Public/Granted day:2014-04-24
Information query
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