Invention Grant
- Patent Title: Floor-to-ceiling partition wall assembly
- Patent Title (中): 落地式隔墙装配
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Application No.: US14028908Application Date: 2013-09-17
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Publication No.: US08966842B2Publication Date: 2015-03-03
- Inventor: Allen C. Hager , Mark T. Slager , Steven Keith Meek
- Applicant: Steelcase Inc.
- Applicant Address: US MI Grand Rapids
- Assignee: Steelcase Inc.
- Current Assignee: Steelcase Inc.
- Current Assignee Address: US MI Grand Rapids
- Agency: Price Heneveld LLP
- Main IPC: E04H1/00
- IPC: E04H1/00 ; E04H14/00 ; E04H3/00 ; E04H5/00 ; E04H6/00 ; E04B2/74 ; E04B2/78 ; E06B3/46 ; E04B2/72 ; E06B1/00 ; E06B1/52 ; E05C1/08 ; E06B3/36 ; E04B2/00 ; E04H1/06 ; E04B2/56 ; E04B1/82 ; E05B65/00 ; E05C1/06 ; E06B3/32 ; E05B15/00

Abstract:
A panel wall system includes a frame assembly adapted to support a plurality of skin assemblies in a floor-to-ceiling relationship, wherein the skin assemblies include solid panel assemblies as well as captured glass skin assemblies. The solid panel assemblies are coupled to the frame assembly via latch mechanisms having actuator levers which are accessible in gaps formed between adjacent solid panel assemblies, wherein a user of the wall panel system can discern whether or not a panel assembly is properly engaged with the frame assembly based on the visibility and positioning of the actuator lever.
Public/Granted literature
- US20140075869A1 FLOOR-TO-CEILING PARTITION WALL ASSEMBLY Public/Granted day:2014-03-20
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