Invention Grant
- Patent Title: Sensor device
- Patent Title (中): 传感器装置
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Application No.: US13652293Application Date: 2012-10-15
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Publication No.: US08966991B2Publication Date: 2015-03-03
- Inventor: Kari Ullakko , Kotaro Sasaki , Peter Müllner
- Applicant: Boise State University
- Applicant Address: US ID Boise
- Assignee: Boise State University
- Current Assignee: Boise State University
- Current Assignee Address: US ID Boise
- Agency: Parsons Behle & Latimer
- Main IPC: G01B7/16
- IPC: G01B7/16 ; G01L1/12

Abstract:
An apparatus for sensing strain or stress includes a body including magnetic shape-memory alloy (MSMA) material, having a first axis. A first drive coil and first sensor coil are wound around the body about the first axis. The drive coil is coupled to a power source and configured to generate an alternating magnetic field on the body. The first sensor coil is configured to detect changes in inductance of the body due to changes in magnetic permeability of the body with deformation thereof.
Public/Granted literature
- US20130091954A1 SENSOR DEVICE Public/Granted day:2013-04-18
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