Invention Grant
US08967080B2 Top plate of microwave plasma processing apparatus, plasma processing apparatus and plasma processing method
有权
微波等离子体处理装置,等离子体处理装置和等离子体处理方法的顶板
- Patent Title: Top plate of microwave plasma processing apparatus, plasma processing apparatus and plasma processing method
- Patent Title (中): 微波等离子体处理装置,等离子体处理装置和等离子体处理方法的顶板
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Application No.: US12867343Application Date: 2009-02-10
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Publication No.: US08967080B2Publication Date: 2015-03-03
- Inventor: Caizhong Tian , Kiyotaka Ishibashi , Toshihisa Nozawa
- Applicant: Caizhong Tian , Kiyotaka Ishibashi , Toshihisa Nozawa
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2008-031310 20080213
- International Application: PCT/JP2009/052200 WO 20090210
- International Announcement: WO2009/101927 WO 20090820
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23F1/00 ; H01L21/306 ; H05H1/46 ; H01J37/32

Abstract:
A plasma generation chamber of a plasma processing apparatus is closed by a top plate 3. The top plate 3 has recesses 3A on its surface facing the plasma generation chamber and a central recess 3B on an opposite surface. The top plate 3 is coupled to an antenna thereon. If a microwave is supplied to the antenna, the microwave is radiated through slots of the antenna. The microwave is propagated through the top plate 3 such that the microwave has a plane of polarization and the microwave forms a circularly polarized wave as a whole. Here, resonance absorption of the microwave occurs at a side surface of recesses 3A and the microwave is propagated within the recesses 3A in a single mode. Strong plasma can be generated within each of the recesses 3A, so that a stable plasma mode can be generated in the top plate 3.
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