Invention Grant
- Patent Title: Heat dissipating device supporting apparatus
- Patent Title (中): 散热装置支撑装置
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Application No.: US13456490Application Date: 2012-04-26
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Publication No.: US08967586B2Publication Date: 2015-03-03
- Inventor: Chao-Jun Zhu , Jin-Biao Ji , Zhi-Jiang Yao
- Applicant: Chao-Jun Zhu , Jin-Biao Ji , Zhi-Jiang Yao
- Applicant Address: CN Wuhan TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (WuHan) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (WuHan) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Wuhan TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110241332 20110822
- Main IPC: F16M1/00
- IPC: F16M1/00 ; H05K7/20 ; F28F3/06 ; H01L23/36 ; H01L23/40

Abstract:
A supporting apparatus, configured to support a heat dissipating device, includes a bracket, two adjusting structures, and two mounting portions. Each of the two mounting portions defines a mounting hole. Each of the two adjusting structures is engaged in each of the mounting holes and includes an adjusting member and an installation member engaged with the adjusting member. Each of the adjusting members defines a through hole. The two adjusting members are rotatable relative to the two mounting portions from a first position to a second position. When the adjusting members are in the first position, a first line is running through the two through holes. When the adjusting members are in the second position, a second line is running through the two through holes, and a length of the first line is less than a length of the second line.
Public/Granted literature
- US20130048820A1 HEAT DISSIPATING DEVICE SUPPORTING APPARATUS Public/Granted day:2013-02-28
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