Invention Grant
- Patent Title: Bolting structure of sub-frame
- Patent Title (中): 子框架螺栓结构
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Application No.: US13801740Application Date: 2013-03-13
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Publication No.: US08967671B2Publication Date: 2015-03-03
- Inventor: Yong Dae Kim , Nam Young Lee , Seung Hyun Kang
- Applicant: Kia Motors Corporation
- Applicant Address: KR Seoul
- Assignee: Kia Motors Corporation
- Current Assignee: Kia Motors Corporation
- Current Assignee Address: KR Seoul
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0139099 20121203
- Main IPC: B62D21/00
- IPC: B62D21/00 ; B62D21/11 ; B62D25/08

Abstract:
A bolting structure of a sub-frame includes a reinforcer mounting the sub-frame through a side member. The reinforcer includes: a reinforcing member disposed to intersect with the side member in a cross shape and bolted, together with the side member, to a lower panel; an inner pipe disposed at the side member from surfaces interfacing between the reinforcing member and the side member; an outer pipe disposed at the reinforcing member from the surfaces interfacing between the reinforcing member and the side member and inserted into the sub-frame; and a bolt bolted to the inner pipe through the outer pipe and fixing the sub-frame.
Public/Granted literature
- US20140151991A1 BOLTING STRUCTURE OF SUB-FRAME Public/Granted day:2014-06-05
Information query
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