Invention Grant
- Patent Title: Modular exhibit structure
- Patent Title (中): 模块展示结构
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Application No.: US14030838Application Date: 2013-09-18
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Publication No.: US08967739B2Publication Date: 2015-03-03
- Inventor: David Christian Jensen , Alexander Renowitzky , Vlado Radanovic
- Applicant: Logic Exhibit System Ltd.
- Applicant Address: CA Vancouver, BC
- Assignee: Logic Exhibit System Ltd.
- Current Assignee: Logic Exhibit System Ltd.
- Current Assignee Address: CA Vancouver, BC
- Agency: Oyen Wiggs Green & Mutala LLP
- Main IPC: A47F3/00
- IPC: A47F3/00 ; A47F5/10 ; E04B2/74 ; A47B47/05

Abstract:
Components for assembling a modular exhibit structure are provided. These components include: frames, connectors (for connecting together frames), panels (for mounting within frames), cover plates (for mounting over sides of frames), and dust covers (for mounting over top of connected frames). These components are configured to allow a single person to assemble an exhibit structure without any specialized tools or mechanical skills.
Public/Granted literature
- US20140034596A1 MODULAR EXHIBIT STRUCTURE Public/Granted day:2014-02-06
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