Invention Grant
- Patent Title: Liquid ejecting apparatus
- Patent Title (中): 液体喷射装置
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Application No.: US14304724Application Date: 2014-06-13
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Publication No.: US08967761B2Publication Date: 2015-03-03
- Inventor: Hironori Sato , Masako Fukuda , Tomohiro Sayama
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2013-128245 20130619
- Main IPC: B41J29/393
- IPC: B41J29/393 ; B41J11/00

Abstract:
A liquid ejecting apparatus has a liquid ejecting head capable of ejecting an ink containing thermoplastic resin particles from nozzles to a landing target and a heating unit of heating ink droplets landing on the landing target, in which the heating unit heats the ink droplets at a filming control temperature according to the minimum film forming temperature at which the filming of the surface of the ink droplets starts to thereby control the filming degree of the surface of the ink droplets.
Public/Granted literature
- US20140375720A1 LIQUID EJECTING APPARATUS Public/Granted day:2014-12-25
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