Invention Grant
- Patent Title: Circuit-terminal connecting device
- Patent Title (中): 电路端子连接装置
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Application No.: US13671362Application Date: 2012-11-07
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Publication No.: US08968005B2Publication Date: 2015-03-03
- Inventor: Takeshi Hirakawa
- Applicant: Dai-Ichi Seiko Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Dai-Ichi Seiko Co., Ltd.
- Current Assignee: Dai-Ichi Seiko Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Studebaker & Brackett PC
- Priority: JP2011-261517 20111130
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A circuit-terminal connecting device comprising a first connector having a first housing fixed to a main circuit board and first contacts supported by the first housing to be connected with first circuit-terminals provided on the main circuit board and a second connector having a second housing attached to a flat circuit member and second contacts supported by the second housing to be connected with second circuit-terminals provided on the flat circuit member. The first housing of the first connector fits into a hole formed in the second housing of the second connector so as to create an electrical piling connection between the main circuit board and the flat circuit member wherein the flat circuit member is laid on top of the main circuit board and the first circuit-terminals are electrically connected with the second circuit-terminals through the first and second connectors.
Public/Granted literature
- US20130137281A1 CIRCUIT-TERMINAL CONNECTING DEVICE Public/Granted day:2013-05-30
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