An interface assembly for a panel board is provided. The interface assembly includes an interface assembly body and a number of conductor assemblies. The interface assembly body includes a front side and a back side, said body further defining a number of conductor passages. Each conductor passage extends from said interface assembly body front side to said body back side. The conductor assemblies each includes a stab coupling assembly and a secondary coupling assembly. Each stab coupling assembly and each said secondary coupling assembly are coupled and are in electrical communication. Each stab coupling assembly is disposed in a conductor passage. When the interface assembly body is mounted in a panel board, each stab coupling assembly is coupled to, and in electric communication with a stab. Each secondary coupling assembly can be coupled to another panel board device.