Invention Grant
- Patent Title: Apparatus and methods for processing a substrate
- Patent Title (中): 用于处理衬底的装置和方法
-
Application No.: US13251064Application Date: 2011-09-30
-
Publication No.: US08968485B2Publication Date: 2015-03-03
- Inventor: Arjun Mendiratta , Cheng-Yu Lin , David Mui
- Applicant: Arjun Mendiratta , Cheng-Yu Lin , David Mui
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Martine Penilla Group, LLP
- Main IPC: B08B3/00
- IPC: B08B3/00 ; B08B1/02 ; B08B3/04 ; H01L21/02 ; H01L21/67

Abstract:
An apparatus for processing a substrate, comprising: a process chamber having a track; a carrier connected to the track; upper and lower proximity heads in the chamber and positioned along the path, the proximity heads having opposing faces that define a gap in which a meniscus of fluid is formed, the path being defined along the gap between the opposing faces; a first pre-wet dispenser and a second pre-wet dispenser disposed along side of the upper proximity head and directed toward the path; a drive for moving each of the pre-wet dispensers between a center position along the length of the upper proximity head and opposite outer positions near outer ends of the upper proximity head; and a pre-wet controller for causing the drive to move each of the first and second pre-wet dispensers based on a position of the carrier when moved under the first and second pre-wet dispensers.
Public/Granted literature
- US20130081655A1 APPARATUS AND METHODS FOR PROCESSING A SUBSTRATE Public/Granted day:2013-04-04
Information query